Finally, AMD’s highly-anticipated EPYC Milan-X server processors have been launched at its Accelerated Data Center Premiere. It is quite exciting because this will mark a new era for 3D V-Cache stacking technology which AMD has mastered in partnership with TSMC.
You can now expect 3x more L3 cache because of this and naturally because of this with the same Zen 3 cores and a new 3D V-Cache, you will get even better performance. AMD EPYC Milan-X server CPU lineup will possess four processors and the EPYC 7773X is the flagship with 64 cores and 128 threads.
“We are in a high-performance computing megacycle that is driving demand for more compute to power the services and devices that impact every aspect of our daily lives,” said Dr Lisa Su, president and CEO, AMD.
“We are building significant momentum in the data centre with our leading product portfolio, including Meta’s adoption of AMD EPYC to power their infrastructure and the buildout of Frontier, the first U.S. exascale supercomputer which will be powered by EPYC and AMD Instinct processors.”
“In addition, today we announced a breadth of new products that build on that momentum in next-generation EPYC processors with new innovations in design, leadership, 3D packaging technology, and 5 nm high-performance manufacturing to further extend our leadership for cloud, enterprise and HPC customers.”
AMD previewed the use of innovative 3D chiplet packaging technology in the data centre with the first server CPU using high-performance 3D die stacking. The 3rd Gen AMD EPYC processors with AMD 3D V-Cache, codenamed “Milan-X,” represents an innovative step forward in CPU design and packaging, and will offer a 50% average performance uplift across targeted technical computing workloads.
- 3rd Gen EPYC with AMD 3D V-Cache will offer the same capabilities and features as the 3rd Gen EPYC processors and they will be drop-in compatible with a BIOS upgrade, delivering easy adoption and performance enhancements.
- Microsoft Azure HPC virtual machines featuring 3rd Gen EPYC with AMD 3D V-Cache are available today in Private Preview, with broad rollout in the coming weeks. More information on performance and availability is available here.
- 3rd Gen EPYC CPUs with AMD 3D V-Cache will launch in Q1 2022. Partners including Cisco, Dell Technologies, Lenovo, HPE and Supermicro are planning to offer server solutions with these processors.
Using a new 3D V-cache stacking technology, AMD is taking the cache amount up to an insane 768 MB, this makes the upcoming EPYC Milan-X processors best-in-class even without many architectural changes. The cache structure has now changed, as it will include the standard 256 MB of L3 cache we saw previously with Zen 3 based EPYC Milan, and now we have a humongous 512 MB cache coming from the stacked L3 SRAM.
This means that each of the Zen 3 CCDs will feature 64 MB of L3 cache, and essentially what AMD showed previously, there are endless possibilities with 3D V-cache stacking, AMD can even use 8 CCDs to reach 32 cores as that can be achieved with a 4 CCD SKU.
So, with triple the cache previously, AMD has made a new set of beast processors for servers, and worry not gamers, 3D V-cache based Zen 3 Ryzen processors are also coming soon. AMD has announced these EPYC Milan-X CPUs will start shipping in Q1 2022 and we hope we will have an announcement of new refreshed Zen 3 CPUs most probably at CES 2022.
Watch the keynote highlights here:
