In its annual report to shareholders, the Taiwan Semiconductor Manufacturing Company (TSMC) provided information on its next-generation 2-nanometer semiconductor manufacturing process. The largest contract chip manufacturer in the world, TSMC, shipped over ten million wafers last year despite the beginnings of a slowdown in the sector. Nanosheet transistors will be used in the company’s 2-nanometer manufacturing process, which will initially be produced in two different Taiwanese facilities.
One of the first businesses in the world, TSMC, began manufacturing chips using the 3-nanometer manufacturing process in the latter part of last year.
TSMC entered 3-nanometer production as the second company in the world during the volume production stage of manufacturing, which comes before mass production, as its smaller rival Samsung Foundry had taken the lead a few months earlier.
According to the company’s annual report, the taiwanese chip makers wafer shipments increased despite a slowdown in the semiconductor industry that began at the end of 2022. Last year, the company shipped 15.3 million 12-inch equivalent wafers, an increase of 7.7% over the previous year.
Furthermore, 53% of the total mix was made up of wafers using advanced chip manufacturing technologies (below 7 nanometers), as opposed to 50% of the total wafers shipped in 2021.
Overall, TSMC increased its market share by 4% and shipped 30% of the non-memory semiconductor products sold worldwide. Regarding 2-nanometer, or N2, TSMC disclosed that it intends to start testing the technology next year and transition to volume testing in 2025.
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