In the ever-evolving realm of smartphones, the heart of these devices lies in their System-on-Chip (SoC). As we step into 2024, anticipation builds around the latest and most powerful mobile processors that will drive the next generation of flagship smartphones.
These SoCs are not merely the brains behind the operation but are pivotal in shaping the user experience, from performance and efficiency to cutting-edge features. Let’s delve into the anticipated flagship smartphone SoCs that are set to dominate the smartphone landscape in 2024.
The Upcoming Flagship Smartphone SoCs
Kirin 9000SL and 8000
Huawei introduces the cutting-edge Kirin 9000SL 5G and Kirin 8000 5G chips to overcome challenges posed by sanctions, providing users with a seamless experience. Despite sharing the same series and origin, insiders reveal performance variations between the two Kirin 5G chips. Manufactured by SMIC using a 7nm process, both chips showcase Huawei’s dedication to advanced semiconductor technology. The Kirin 9000SL 5G, in particular, is expected to outperform its counterpart, offering users enhanced processing capabilities. These processor are among the best upcoming flagship smartphone SoCs.
Qualcomm Snapdragon 8 Gen 3
The Snapdragon 8 Gen 3 ranks among the best upcoming flagship smartphone SoCs. It brings substantial improvements over its predecessor, the Snapdragon 8 Gen 2 SoC. Notable enhancements include an upgraded Kryo CPU with speeds up to 3.3 GHz, boasting a 30% performance increase and 20% power efficiency boost. The introduction of Arm Cortex-X4 technology, an enhanced AI Engine, Adreno GPU, Hexagon NPU, and various upgrades for gaming, photography, and AI applications further elevate Qualcomm’s mobile offerings. Emphasizing AI capabilities, the Snapdragon 8 Gen 3 supports multi-modal generative AI models, large language models, language vision models, and transformer network-based automatic speech recognition.
MediaTek Dimensity 9300
The MediaTek Dimensity 9300 is among the best upcoming flagship smartphone SoCs. It introduces a primary CPU core, Cortex-X4, with a clock speed of 3.25GHz, accompanied by three Cortex-X4 cores at 2.85GHz and four Cortex-A720 cores at 2.0GHz. In contrast, the Snapdragon 8 Gen 3 SoC features five A720 performance cores with speeds up to 3.2GHz. Built on 3rd generation TSMC 4nm chip production, the Dimensity 9300 claims to be 33% more power-efficient than its predecessor, the Dimensity 9200, while providing a 40% multi-core performance upgrade.
Additionally, the Dimensity 9300 boasts an Arm’s 12-core Immortalis-G720 MC13 GPU with hardware-based ray tracing for gaming, marking a 46% increase in power compared to its forerunner. Enhanced AI capabilities and an upgraded AI processing unit (APU 790) further contribute to the chipset’s advanced features.
Apple A17 Pro
The A17 Pro, with 19 billion transistors, surpasses its predecessor, the A16, which had 16 billion transistors. In comparison, the A15 had 15 billion, the A14 11.8 billion, and the A13 8.5 billion transistors. Featuring six CPU cores, including high-performance cores that are now 10% faster, and four efficiency cores, the A17 Pro aims to provide optimal performance while respecting the phone’s limited battery capacity. This transistor increase underscores Apple’s commitment to pushing the boundaries of processing power in their A-series chips.
