Earlier last week, Qualcomm announced that it will be launching its next-gen Snapdragon 8 Gen2 chips on the 15th of November 2022 at its annual Snapdragon summit. A recent leak reveals some aspects of the chip’s performance.
Snapdragon 8 Gen2 detailed specs:
The latest report indicates that TSMC will be the only chipmaker involved in the manufacturing process and it will not be based on TSMC’s 3nm node. Apple has beat Qualcomm in terms of volume of orders and it has already inked a deal with TSMC to reserve the node for its M2 Pro and M2 Max chips.
This means that Qualcomm is using the 4nm node for the SD Gen2 chip, it is the same node on which its predecessor is based. Samsung is another chipmaker that has been making chips based on the 3nm node but for some reason, it is yet to receive any orders from smartphone makers to manufacture chips.
The reason Qualcomm has opted to not ink a deal with Samsung is because of the negative reviews it received for the SD 8 Gen1 chip that was based on Samsung’s 4nm node. Reports have specified that Qualcomm could go for a “1+2+2+3” cluster over the “1+3+4” CPU cluster that’s been used on previous Snapdragon chips.
The configuration arrives with a high-performance core that has been dubbed Makalu, it has two Mattern cores and three Klein R1 cores. These codes are likely in reference to Cortex-X3, Cortex-A715, and Cortex-A510. These are all the latest CPU architectures that ARM has unveiled.
The SD 8 Gen2 will be Qualcomm’s most recent X70 5G modem along with its unique CPU design. This enables it to achieve new peak download speeds while remaining power efficient by up to 60%. As per Yogesh Brar, we can expect a 10% improvement in GPU performance in order to make the overall performance of the chip better.