SK hynix Showcases Next-Gen AI Memory at CES 2026

SK hynix is making waves at CES 2026 with cutting-edge AI memory innovations, including the world's first public showcase of its 16-layer HBM4 with 48GB capacity. Under the theme "Innovative…

By Hardik Dhamija

January 6, 2026

2 min read

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SK hynix is making waves at CES 2026 with cutting-edge AI memory innovations, including the world’s first public showcase of its 16-layer HBM4 with 48GB capacity. Under the theme “Innovative AI, Sustainable Tomorrow,” the semiconductor leader demonstrates how advanced memory solutions power the expanding AI ecosystem.

16-Layer HBM4 with 48GB Debuts

SK hynix unveiled its 16-layer HBM4 product featuring 48GB capacity at CES 2026, marking a significant technical achievement. This next-generation high-bandwidth memory builds upon the company’s 12-layer HBM4 that achieved record speeds of 11.7Gbps. Stacking 16 layers dramatically increases manufacturing complexity due to thinner spacing between DRAM dies and more precise alignment requirements.

Next-Generation AI Memory Lineup

Product	Key Features
16-Layer HBM4	48GB capacity, successor to 12-layer 36GB model
12-Layer HBM3E	36GB, current market leader for AI servers
SOCAMM2	Low-power memory module for AI servers
LPDDR6	On-device AI, enhanced speed and efficiency
321-Layer NAND	2Tb QLC for ultra-high capacity eSSDs

Advanced Computing-in-Memory Solutions

SK hynix showcased revolutionary memory technologies that integrate computational capabilities directly into memory chips. The lineup includes custom HBM optimized for specific AI chips, AiMX accelerator cards for large language models, Compute-using-DRAM performing simple computations within cells, and CMM-Ax adding computational functionality to CXL memory modules.

For custom HBM, the company prepared a large-scale mock-up allowing visitors to witness the innovative structure that integrates computation and control functions previously handled by GPUs or ASICs.

Market Leadership Position

Goldman Sachs projects SK hynix will maintain its dominant HBM market position with over 50% total market share through 2026. The company serves major tech clients including becoming the first HBM3E supplier for Google’s latest Tensor Processing Units.

Justin Kim, President and Head of AI Infra at SK hynix, emphasized that as customer technical requirements evolve rapidly, the company will deliver differentiated memory solutions through close collaboration.

Visit SK hynix at CES 2026 (Venetian Expo, January 6-9) or explore more semiconductor news at TechnoSports. Learn more at SK hynix official site.