The Snapdragon 8 Gen1 chip is having a rough time in the market rivaling the chip company MediaTek as their TSMC-produced Dimensity chips have been performing better than ever.

The early Benchmark scores of the Dimensity 9000 were higher than the Snapdragon 8 Gen1 chip and now, the Dimensity 8100 has also beaten Qualcomm’s chip. Tipster Digital Chat Station shared the Geekbench results of the Dimensity 8100, Snapdragon 8 Gen1, and the Snapdragon 888, where the MediaTek chip has easily beaten the other two on the multi-core test.

All the devices that were used were Realme devices, with the device numbered RMX3562 or the Realme GT NEO3.

The Dimensity 9000 on the other hand ranked last in the single-core test due to a powerful Cortex-X1 core on both the Qualcomm chips.

Irrespective of this, it is remarkable to come across a chip that is not MediaTek’s best offering this year but has managed to beat two flagship processors from Qualcomm.

The Dimensity 9000 chip and 8000 Series are exclusive to the upper mid-range smartphones. In addition to this, the Dimensity 8000 chips use an older 5nm process in comparison to the 4nm process used by the Snapdragon 8 Gen1.

Qualcomm has another trick up its sleeve, another flagship processor from the chipmaker has been making rounds lately, and going by the SM8475 model number, it could be an upgraded version of the Snapdragon 8 Gen1 chip, probably a Plus version.

This chip will be made with TSMC’s 4nm process as opposed to Samsung’s 4nm process used for the first version of the 8 Gen1 chip. It will be interesting to see if the upgraded version will be better than the base version.

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