The packaging for Intel’s Core i9-13900K Raptor Lake CPU has been revealed, and it is significantly thinner than the outgoing one. The Raptor Lake CPUs from Intel will be formally presented the following week. The most recent disclosure came from Twitter leaker HXL, who discovered the image in a closed WeChat group. The plastic wafer on the new Intel Raptor Lake Core i9-13900K CPU box has a new silver colour scheme and a slimmer design.
Intel has been using premium-style designs for its K-series processor boxes in recent years. The prior approach, which was last used in August, has been abandoned in favour of the most recent box design. The final box contained the third iteration of the K-series processors produced by the business.
The Intel 13th Gen Raptor Lake Desktop processors will feature:
- Up To 24 Cores & 32 Threads
- Brand New Raptor Cove CPU Cores (Higher P-Core IPC)
- Based on 10nm ESF ‘Intel 7’ process node
- Up To 6.0 GHz clock speeds (expected)
- Double The E-Cores on certain variants
- Increased Cache for both P-Cores & E-Cores
- Supported on existing LGA 1700 motherboards
- New Z790, H770, and B760 motherboards
- Up To 28 PCIe Lanes (PCH Gen 4 + Gen 3)
- Up To 28 PCIe Lanes (CPU Gen 5 x16 + Gen 4 x12)
- Dual-Channel DDR5-5600 Memory Support
- 20 PCIe Gen 5 Lanes
- Enhanced Overclocking Features
- 125W PL1 TDP (Flagship SKUs)
- AI PCIe M.2 Technology
With its new, sleek box design, Intel will be able to send more CPUs to retailers and distributors, giving the business a modest advantage over AMD, which uses a larger packaging for its AMD Ryzen 7000 series processors.
The company’s Innovation event is scheduled for September 27th, the same day as the official release date of the Intel 13th Gen Core processors. Then, beginning in October, the next processor series will be accessible.
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