Xiaomi Announces Civi 3 Featuring Dimensity 8200 Ultra Chipset and Disney Special Edition

Rumors about the upcoming Xiaomi Civi 3’s Dimensity 8200 processor first surfaced in January. The Redmi K60e, Vivo V27 Pro, and Vivo S16 Pro are just a few smartphones powered by the Dimsnity 8200, a 5G SoC created using TSMC’s 4nm manufacturing process. The Dimensity 8200 Ultra chipset, a customized version of the Dimensity 8200, will be used in the Civi 3, Xiaomi has now announced.

All About the Xiaomi Civi 3!

The manufacturer has not yet provided any information regarding this unique chip. To put things in perspective, the Dimensity 8200 has eight total cores, including one Cortex-A78 core that can run at up to 3.1 GHz, three Cortex-A78 cores that can run up to 2.85 GHz, and four Cortex-A55 cores that can run up to 2.0 GHz. A Mali-G610 MC6 GPU is also present. With 5G connectivity, the Dimensity 8200 can reach 17 Gbps of speed. Additionally, it has Bluetooth 5.3 and Wi-Fi 6E compatibility.

According to earlier sources, the coming Civi 3 smartphone is expected to keep its 6.55-inch OLED panel with curved edges, similar to that of the Civi 2. The front of the device will have two 32-megapixel selfie cameras. A Sony IMX800-series primary camera, renowned for its superb photographic capabilities, will be mounted on the device’s back.

The Dimensity 8200-Ultra chipset is expected to power the Civi 3, which could deliver excellent performance and efficiency. It is expected to have a huge 512 GB of inbuilt storage and a range of RAM options up to 12 GB. The handset is rumored to enable 67W fast charging, enabling speedy and convenient battery recharging, which would gratify fans of fast charging.

In an interesting turn of events, a recent Weibo post revealed that the Civi 3 will have a special edition version created in partnership with Disney, giving the smartphone lineup a dash of individuality and charm.