NVIDIA GeForce RTX 5090 Leaked with 16+6+7 Power Phase Design

Fresh leaks of NVIDIA’s GeForce RTX 5090 GPU are circling, now detailing the PCB layout, specifically the power stage configuration and number of layers. Now that we are getting close to the official announcement, we are slowly learning more information about the RTX 50 “Blackwell” flagship GPU, allowing us to get a better idea of what to expect in terms of specifications. NVIDIA has also made some changes to the power phase design, going from the 20+3 design on the GeForce RTX 4090 to a 16+6+7 power phase design for the RTX 5090, as well as a report coming from Benchlife.

NVIDIA GeForce RTX 5090 Leaked with 16+6+7 Power Phase Design and 14-Layer PCB Configuration Ahead of Launch

Other rumored features of the RTX 5090, in addition to power phase changes, include a 14-layer PCB design (it might vary depending on the model). The reference model is likely the one being discussed here. The report also reaffirms some other leaked details about the GPU, which gives us a better idea of what we can expect from this next-generation flagship. The GeForce RTX 5090 is said to feature the Blackwell GB202-300, 32 GB of GDDR7 memory, and a 600W TDP. New specs also include a new power phase design and a 12V-2×6 (16-pin) connector for power delivery.

Furthermore, the GPU will also feature PCIe 5.0 Express slots for enhanced compatibility with the latest motherboards. We’ve also seen the first look at the PCB design, which reveals a significant increase in the size of the onboard silicon, along with a beefed-up IHS, likely to handle the higher thermal output.

With these changes, the GeForce RTX 5090 is expected to bring substantial leaps in gaming performance, likely establishing itself as a dominant player in the high-end GPU market. The GeForce RTX 5090 is expected to launch either by the end of January or early February. More detailed information on the next-gen lineup will likely be revealed at CES 2025, just a few weeks away.

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