Unlike the Snapdragon 8 Gen 4 and A17 Pro chips, both inefficiency cores or even clusters, the Dimensity’s 9400 will be revealed soon this year without custom cores. The tipster enunciates that MediaTek and ARM are working together to feature the latest CPU designs, such as the ARM’s ”BlackHawk” architecture into the Dimensity 9400. This integration results in better IPC performance than the current generation chips, making it a softer version than the Kunpeng 920.
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Comparing them on multi-threaded works, Dimensity 9400 will probably have a more significant performance. Just like Dimensity 9300, the launching integrated system is expected to also come without inefficient cores. On the other hand, the Cortex-X5 addition, based on ARM’s new BlackHawk architecture, is performing impressively in internal testing, as a Weibo tipster Digital Chat Station. It does not specify the performance but says that its IPC is higher compared to Apple’s A17 Pro and Qualcomm’s Nuvia, most likely Snapdragon 8 Gen 4.
Dimensity 9400, rumored to have a 150mm² die size making it the biggest for a smartphone so far, and having 30 billion transistors, diffracts its superiority. With its bigger size, MediaTek can give it a bigger cache and other strip-downs, putting it ahead. However, earlier rumors suggested that the Cortex-X5 faced issues with high power draw and overheating. It remains to be seen if MediaTek and ARM have addressed these concerns, requiring monitoring of various benchmarks to confirm.
Except for Google and Apple, every major smartphone manufacturer has partnered with MediaTek, with Vivo rumored to be the first Dimensity 9400 customer. Presumably, having witnessed the capabilities of this chipset firsthand, the Chinese company has secured the first shipment to use in its future flagships. With the impressive performance of the Dimensity 9300, expectations are high for the Dimensity 9400, and MediaTek is anticipated to excel on all fronts, intensifying competition in the market.
