Intel is all set to announce its upcoming Rocket Lake-S desktop processors next month, and it seems already their new CPU packaging is leaked. What seems more interesting is that Intel will not be making new Core i3 CPUs based on their unique architecture but refresh their Comet Lake SKUs.
However, the CPUs from Core i5 and above will be based on a new architecture, but according to previous rumours, we expected to use 11th Gen branding even if its a refresh. But, to our surprise, Intel seems to use the same 10th Gen branding but with an updated Intel Core CPU packaging.
Even though the packaging looks simple, basically resembling the look of the Core i3 logo with the new Intel vibe. The CPU has been pictured in a Malaysian store and seems to be part of the F-Series and will support LGA 1200 socket motherboards.
Intel looks to target more budget gamers as its Core i3 lineup is very economical and provides better value than AMD’s. The upcoming Core i3-10105 should have some minor clock speed increase over Core i3-10100 and do not expect built-in Xe-LP graphics, as it would increase costs.
It will be interesting to see how and when Intel introduces both new Rocket Lake-S CPUs and refreshed Comet Lake processors to the market and at what prices, obviously!
Buy the Intel Core i3-10100F: https://amzn.to/3d3A5ER
