Honor recently began teasing its upcoming foldable smartphone, the Honor Magic V. Although the company has not yet outed any details with respect to it, apart from letting us know that it will in fact be Honor’s ‘first foldable flagship’, and that it will be out very soon.
As per a leaked presentation slide from China, there is another interesting piece of information with respect to Honor’s upcoming foldable device, the Honor Magic V.
The foldable device will not only mark Honor’s foray into the foldable device segment but it will also be the first foldable device to feature the latest Qualcomm Snapdragon 8 Gen 1 chipset, at least for now as no other brand has hinted at releasing a foldable device powered with this chip.
The Honor Magic V will be the first device to have this chip but definitely not the last, we can expect a lot of foldable devices to feature this chip in 2022.
As per rumors, the Honor Magic V is expected to release next month, so we can count on more details to emerge in the coming weeks.
As per previous leaks, the Honor Magic V will have a 6.5″ cover display and an 8″ internal screen (when unfolded). Both the panels are rumored to be supplied by BOE.
Source: Weibo
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