MediaTek Set to Unveil Dimensity 8400 SoC in China on December 23

MediaTek is going to announce its next-gen Dimensity chipsets in China next week. The Taiwanese semiconductor giant announced the launch on its social media channels, though did not disclose the specific names of the new chips. We’ll get the long-awaited Dimensity 8400 SoC as it will be the successor of last year’s Dimensity 8300 SoC. This also has a rumored 4nm chipset with 1+3+4 core architecture, and it has scored over 1.8 million AnTuTu points.

MediaTek to Unveil Dimensity 8400 SoC on December 23: Successor to Dimensity 8300

Now, MediaTek officially unveiled its new Dimensity chips launch event teasing with a post on Weibo, which is set to be held on December 23, 03:00 PM (12:00 PM IST). Although the exact name of the chipset has not been officially confirmed, it is speculated to be one of the models the Dimensity 8400 SoC unveiled at the event.

Its successor, the Dimensity 8400 will be based on TSMC’s 4nm process it seems, and is set to replace the Dimensity 8300. It is expected to feature an octa-core configuration with 1+3+4 and may pack the Immortalis-G720 MC7 GPU. Benchmarks indicate that the chipset securely exceeded 1.8 million points on AnTuTu. The SoC is expected to contain a prime CPU core with a frequency of 3.25GHz with three more CPU cores running at 3.0GHz and four more limiting at 2.1GHz. It should directly rival Qualcomm’s Snapdragon 8 Gen 3.

OEMs are expected to equip the Dimensity 8400 SoC in smartphones starting at CNY 1,500 (approximately ₹17,250). The Redmi Turbo 4 is expected to be the first device to launch with the Dimensity 8400, slated for release in China in January next year. This device may also appear in other markets as the Poco X7. Other rumored devices such as the Oppo Find X8S and Redmi K80E are also expected to feature the Dimensity 8400 SoC.

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