MediaTek is set to release their 3nm chipset called Dimensity 9400 which will utilize TSMC’s second-generation lithography, for improved power efficiency and other advantages. CEO Rick Tsai has announced that the official unveiling is planned for the quarter of this year promising AI capabilities to compete with other high-end smartphone chips. At the time Qualcomm Snapdragon 8 Gen 4 also making use of TSMCs 3nm process is expected to be available.
The All New Dimensity 9400
Although MediaTek’s CEO did not directly compare performance a report from China Times suggests that the Dimensity 9400 will offer improved AI capabilities. The details about the CPU cluster indicate a departure from Qualcomm as MediaTek continues to adopt ARM CPU designs specifically upgrading to the Cortex X5. While it may not exclusively consist of Cortex X5 cores as some rumors suggest it has been confirmed that the Dimensity 9400 will not incorporate efficiency cores like its predecessor, the Dimensity 9300. This change resulted in enhanced core performance.
Regarding AI capabilities there are expectations for the Dimensity 9400 in terms of on-device tasks. It may even surpass the support, for 33 billion parameters provided by the Dimensity 9300 for Language Models. Like the version the Dimensity 9400 is anticipated to have support, for LPDDR5T memory.
This type of memory is important for more RAM, which is necessary for, on-device AI operations. MediaTek has worked together with TSMC to create the world’s 3nm chipset. This chipset offers a power reduction of around 32 percent. Will begin mass production in 2024 as announced earlier this year.
Although MediaTek did not explicitly name the chipset as Dimensity 9400, it is strongly indicated to be their flagship SoC. Recent reports on the alleged Geekbench 6 scores of Snapdragon 8 Gen 4 suggest impressive performance, surpassing its predecessor and the Dimensity 9300. The expectation is that the Dimensity 9400 will exhibit a similar performance leap, but the confirmation awaits the official announcement in Q4 2024.
