In addition to becoming TSMC’s first customer to receive the initial batch of 2nm wafers, Apple is expected to use the Taiwanese manufacturer’s 3DFabric chips for its bespoke silicon. According to the most recent information, Apple is impressed with what its supply chain partner is working on, despite the fact that the technology giant’s first product to use this technology is still a few years away.
According to MoneyDJ, a Taiwanese financial outlet, TSMC’s 3DFabric technology will be used by both AMD and Apple due to the numerous advantages it provides. This 3DFabric chip manufacturing approach will also combine CoWoS (Chip-on-Wafer-on-Substrate) and SoIC (Small Outline Integrated Circuit) technology, according to published information found by IT Home.
The most significant benefit that 3DFabric provides to Apple is increased freedom in designing future bespoke chipsets.
3DFabric allows companies to construct their chips as a system of interconnected pieces rather than a larger monolithic die. 3D chip-stacking clients are projected to grow as demand for high-performance workloads grows, as it does when it comes to pushing the bounds of computing on portable computers.
However, Apple is only claimed to be in trial production right now, implying that the company’s first family of bespoke SoCs combining CoWoS and SoIC technology will not be available for a few years.
In fact, the source indicates that the first MacBook with a 3DFabric processor may not appear until 2025, which may be an optimistic timeframe estimate given Apple’s history of delaying chip introductions due to multiple difficulties. For the time being, the California-based company is thought to be working on its M3, which will be found in various MacBook models. The M3 Pro and M3 Max will be available next year, followed by the M3 Ultra. Following that, we may provide an update on 3DFabric chip development.
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