Qualcomm and BOE Collaborated to develop Innovative Qualcomm 3D Sonic Sensor enabled Displays

Qualcomm announced to establish a “strategic collaboration” with BOE Technology, one of the largest LCD, OLED, and flexible display manufacturing companies in the World. The primary reason is to develop innovative displays with the Qualcomm 3D Sonic fingerprint sensor. They will also work together to extend their technologies from mobile and 5G equipment to XR and IoT.

They already started working to merge Qualcomm’s 3D Sonic fingerprint sensor with BOE’s flexible OLED displays. For this partnership, they are expected to deliver thinnest and high-security fingerprint sensor-enabled display panels. This will be an opportunity for smartphone OEMs to build unique products.

Rather than increasing the product quality, the collaboration will make an impact on the expenses of R&D and BoM, as well as on the streamlined supply chain. Wenbao Gao, executive vice president, and chief executive officer of display and sensor, BOE said, “BOE will start shipping flexible OLED panels with integrated Qualcomm 3D Sonic sensor during the second half of 2020.”

The senior vice president and chief operations officer of Qualcomm Technologies, Roawen Chen said, “Qualcomm Technologies continuously strives to improve our collaboration in China, and collaboration with BOE will be another example of the dedication and our long-term commitment to driving innovations in this vibrant ecosystem,” He also added, “Through this collaboration, we expect that OEMs will have more opportunities to design cutting-edge products that feature OLED displays made with the Qualcomm 3D Sonic fingerprint sensor technology. We look forward to further strengthening our innovative collaboration with BOE in key areas like 5G, XR and IoT.”

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