TSMC to set-up R&D center for its 3nm node is Baoshan, not a manufacturing plant

Earlier reports were making rounds over the internet that the Taiwan Semiconductor Manufacturing Company (TSMC) is planning to construct a 3-nanometer (nm) chip fabrication facility in Baoshan, Hsinchu. The company has outright denied such reports and rumors, and also stated that it is currently building a 3nm production facility in Tainan city.

The report which previously indicated construction in Hsinchu stated that owing to strong demand for 3nm products from American companies such as Apple Inc and Intel Corporation, TSMC was adding production capabilities in the province.

TSMC also stated that, while there are no plans to manufacture 3nm products in Hsinchu, the company will nevertheless research the process node in the city. The Tainan plant will enter trial production later this year and scale up operations in the second half of next year.

While the world is suffering from a shortage of semi-conductor supply, tech giants around the world are looking at TSMC for the solution to their problem. It is also rumored that Intel Corporation will contract TSMC for its next-generation processors.

Earlier we have also heard the rumors that Apple Inc is working with TSMC to research the 2nm node in Baoshan, and the pair will be involved in mass-producing the process node in the city. If this little rumor turned out to be true then we will have truly next-gen processors soon in the market.

However, as of now, we don’t know much information about the rumored 2nm process nodes, but the market has started to adapt to the 5nm nodes. With the latest products coming out from AMD and Apple, 5nm is slowly being adopted in the market. So it’s still quite a while before the market is ready for 2nm.

As reported earlier, TSMC will set-up its R&D center for the 3nm process nodes, and it will start its operations once the company hires 8,000 specialists for the facility.

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