Earlier this month, renowned chip-maker MediaTek has announced its 5G compatible Dimensity 700 chipset. The main highlight of this chip is it is 5G compatible as well as the smartphones which will be powered by this chipset are going to be budget-friendly (expected price, under $200). As per some reports, Huawei is the first smartphone manufacturer to use this Dimensity 700 chipset in its next smartphone. A leak has come out as well regarding the specifications of the upcoming Huawei phone, powered by the Dimensity 700 SoC chipset.
First and foremost, this upcoming Huawei smartphone will be powered by the Dimensity 700 SoC chipset. Regarding the display, this phone will feature a 6.5-inch Full HD+ LCD punch-hole (top-left corner) display. The display is not expected to have any faster refresh rate, like 90Hz or 120Hz. So, there will be a normal refresh rate of 60Hz. As of now, no information regarding the RAM and the internal storage capacities.
Now coming to the camera section, this upcoming Huawei smartphone will feature a quad rear camera setup which includes a 48MP primary sensor along with an 8-megapixel, and two 2-megapixel sensors. For the selfies, this phone will sport a 16Mp selfie snapper at the front. In terms of battery, this phone will be fueled up by a decent 4,000mAH battery with the support of 40W fast charging. And, as it is powered by a 5G chipset, the smartphone will obviously support 5G connectivity.
There is no report regarding the pricing and availability of this Dimensity 700 powered smartphone. This chipset supports up to 12GB of LPDDR4x RAM, UFS 2.2 storage, and a display with a refresh rate of up to 90Hz.