Xiaomi Pad 7 Ultra to Debut with Xring O1 SoC on May 22

Xiaomi is gearing up for a major launch event in China on May 22, 2025, where it will officially unveil its Xring O1 — the company’s most advanced in-house chipset to date. According to a recent teaser, the Xiaomi Pad 7 Ultra will indeed be powered by the Xring O1, as the company is pushing hard to be less dependent on the third-party SoCs.

Xiaomi Xring O1 Chip Launching on May 22; Confirmed to Power Pad 7 Ultra and Xiaomi 15S Pro Flagships

While proper specs are still scarce, Xiaomi itself has said that the Xring O1 is based on TSMC’s 3nm process, making it a direct competitor to Qualcomm’s Snapdragon 8 Elite. As per a recent Geekbench listing, the chip should deliver performance higher than that of the Snapdragon 8 Gen 3 and be almost on par with the Snapdragon 8 Elite. The listing suggests the chip will also be configured with 10 cores.

At first, it was reported that the Xiaomi 15S Pro would be the first to feature the new SoC. However, Xiaomi has now confirmed that the Pad 7 Ultra will also be powered by the Xring O1. Both devices are expected to take center stage during the launch event and are positioned as Xiaomi’s upcoming flagship offerings. According to leaks, the Xiaomi Pad 7 Ultra will feature a 14-inch OLED display with slim bezels and a wide notch, hinting at 3D face recognition — a feature similar to Apple’s Face ID on iPads. The tablet is also expected to pack a large battery with support for 120W fast charging, making it one of the fastest-charging tablets on the market.

Meanwhile, the Xiaomi 15S Pro is rumored to carry forward the design language of the Xiaomi 15 series. It’s expected to feature a 6.73-inch LTPO display with a 120Hz refresh rate, an ultrasonic fingerprint scanner, and a 6,100mAh battery with 90W fast charging. A Leica-branded camera system is also expected, continuing the company’s premium imaging partnership. With the Xring O1 at the heart of both devices, Xiaomi aims to make a bold statement in the flagship space by blending cutting-edge hardware with in-house silicon innovation.

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