TSMC creates a special task force to accelerate the production of 2nm Chips

According to CNA and TorrentBusiness (via @DanNystedt), TSMC has organised an internal ‘One Team’ task force focused to the fast development, trial production, and mass manufacturing of their N2 (2nm-class) process technology. The ‘One Team’ concept implies a cohesive and determined effort to streamline the development and execution of the 2nm process by bringing together skills and resources.

Creating a unique task force is unusual for TSMC, which generally launches pilot and subsequently mass production of its innovative manufacturing technology at a single fab.

According to sources, things will be different this time. TSMC intends to begin concurrent pilot production on its N2 process at two fabs at its Hsinchu site: one in Baochan and one in Kaohsiung. The business plans to begin pilot production at both locations in 2024, followed by volume production in 2025.

At its dedicated R&D centre near Hsinchu, TSMC is developing N2 fabrication technology. As a result, the fabs are located near the R&D building, making it easier for fab engineers to collaborate with teams that designed the production process. Meanwhile, TSMC is reportedly relocating 300 staff from Fab 15A near Taichung and 400 people from Fab 15B near Taichung to its fabs to’support the 2nm projects.’

According to TorrentBusiness, TSMC confirmed the launch of the ‘N2 One Team’ task force but declined to provide detailed details about its structure and specific projects. When discussing TSMC’s N2, the website used projects instead of projects, which is a curious detail.

The world’s leading foundry is working on a number of 2nm-class initiatives, including N2, which will feature gate-all-around nanosheet transistors in early 2026, N2P, which will add backside power supply in early 2027, and N2X, which will have extended performance later this decade. Meanwhile, according to the report, N2 is on its way to the two fabs at the Hsinchu location.

Intel Foundry Services expects to provide its clients 2nm and 1.8nm-class process technology around two years before TSMC. Samsung Foundry, on the other hand, is becoming more competitive in general, which is why it may win some manufacturing contracts on established nodes.

Another possible reason for TSMC forming a separate task group to accelerate its 2nm efforts is the increased complexity of contemporary nodes. The frequency with which new nodes are introduced has increased from two years, as witnessed with N7 and N5, to about three years with N3. Mass production on TSMC’s N2 node is expected to begin in late 2025 or early 2026, nearly three years after N3 high-volume manufacture began.

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