Samsung

Samsung’s $7B US Advanced Packaging Facility: Tesla Deal Catalyst

Samsung is doubling down on its American expansion with a massive $7 billion investment in an advanced packaging facility, riding the momentum from its...

Samsung’s Exynos 2600: Heat Pass Block Technology Revolution

Samsung is addressing the long-standing overheating issues plaguing its Exynos processors with groundbreaking Heat Pass Block (HPB) technology in the upcoming Exynos 2600 chipset. Table...
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Nivedita Bangari

Leak: Samsung reportedly working on an M1 competitor powered by an...

Apple’s M1 chip came as a shock for the silicon industry, and it shook many tech enthusiasts. With garnering praises from every corner of...
Raunak Saha
Get $150 dollar credit when you pre-order Samsung Galaxy Book Pro from Amazon

Get $150 dollar credit when you pre-order Samsung Galaxy Book Pro...

Though the South Korean giant has not been a major force when it comes to the laptop market but has made various notebook components...
Astitva Patle
Samsung Galaxy Z Flip Series Features, might support S Pen

Samsung Galaxy Z Flip Series might support S Pen

Rumors claim Samsung Galaxy Z Fold 3 will support the S Pen, but as for the Galaxy Z Flip 3, there's not a lot...
Sanidhya Bhardwaj
Samsung Galaxy A52 5G support page goes live in India

Samsung Galaxy A52 5G support page goes live in India

The Samsung Galaxy A52 5G has gone live on the Samsung India website suggesting that the launch of the device in India can be...
astroani
Top 10 Best Phones under Rs.16,000 in India | February 2021

Top 10 Best Phones under Rs.16,000 in India

Due to this high demand for mid-range smartphones, a lot of affordable pocket-friendly handsets have been launched in recent days. So, here we are...
Tanish Sengupta
Samsung to invest a whopping $10 billion in 3nm chip development facility in Austin

Samsung develops Advanced Chip Packaging Tech

Yesterday, Samsung introduced its newly developed advanced clip packaging technology for the high-performance application. With the all-new next-generation 2.5D packaging technology, the all-new Interposer-cube (I-Cube...