3D stacking

AMD could bring 3D Stacking with up to 8 Compute Dies, HBM3, PCIe Gen 5.0 & 600W TDP to its upcoming Instinct MI300 GPU

Moore's Law is Dead has detailed AMD Instinct MI300 GPUs, which will be powered by the next-generation CDNA 3 architecture. The new GPUs, which...

Thanks to Alder Lake, we will see Zen 3+ Warhol with AMD’s 3D...

Suddenly, yesterday at Computex 2021, AMD showed their new AMD next-gen 3D V-Cache Stack chiplet technology in partnership with TSMC and showed a prototype...
News
Nivedita Bangari

AMD could bring 3D Stacking with up to 8 Compute Dies,...

Moore's Law is Dead has detailed AMD Instinct MI300 GPUs, which will be powered by the next-generation CDNA 3 architecture. The new GPUs, which...
Raunak Saha
AMD showcases next-gen 3D V-Cache Stack chiplet technology, shows a prototype on Ryzen 5900X

Thanks to Alder Lake, we will see Zen 3+ Warhol with...

Suddenly, yesterday at Computex 2021, AMD showed their new AMD next-gen 3D V-Cache Stack chiplet technology in partnership with TSMC and showed a prototype...
Raunak Saha
Samsung Exynos_technosports.co.in

Samsung implements 3D stacking for 7nm EUV chip to help save...

Being one of the few chip fabricators in the world, Samsung also designs its own chips for its wide range of products, mainly smartphones....