NewsAMD could bring 3D Stacking with up to 8 Compute Dies, HBM3, PCIe Gen 5.0 & 600W TDP to its upcoming Instinct MI300 GPU By Nivedita Bangari Moore’s Law is Dead has detailed AMD Instinct MI300 GPUs, which will be powered by the next-generation CDNA 3 architecture....
TechnologyThanks to Alder Lake, we will see Zen 3+ Warhol with AMD’s 3D V-Cache Stack chiplet technology By Raunak Saha Suddenly, yesterday at Computex 2021, AMD showed their new AMD next-gen 3D V-Cache Stack chiplet technology in partnership with TSMC...
TechnologySamsung implements 3D stacking for 7nm EUV chip to help save both space & power By Raunak Saha Being one of the few chip fabricators in the world, Samsung also designs its own chips for its wide range...