Being one of the few chip fabricators in the world, Samsung also designs its own chips for its wide range of products, mainly smartphones. The South Korean giant does make chips both based on the 7nm process and is currently has entered into the mass production for its next-gen 5nm process.
The chip giant has been working hard on improving its 7nm process and finally, has announced that it has been successful in applying 3D stacking technology on its 7nm extreme ultraviolet (EUV) chips. The technology has been called eXtended-Cube, or X-Cube which involves stacking the SRAM on top of the logic die and is done by Samsung’s Through Silicon Via (TSV) technology that uses tiny holes to interconnect layers on chips.
This technology used by Samsung is different from Conventional system semiconductors that have the logic dies such as CPU and GPU on the same plane as the SRAM. However, with 3D stacking technology, the X-Cube here stacks the SRAM on top of the logic dies, helping to occupy less space and also saves more power, making it much more efficient.
Samsung has also said that these 7nm process chips will have higher data transfer speed due to the new 3D stacking technology. Also, the South Korean giant has promised to continue to push the boundary in developing new technology for the advancement of semiconductor technology, which has become the key to success in this technologically advanced era. Most likely, we will see this new 7nm EUV chips on both Samsung’s upcoming mobile SoCs and those using its chips as well.
via Gizmochina
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