Oppo‘s Reno8 Series could use a combination of different chips such as the Snapdragon 7 Gen1 and MediaTek Dimensity chips paired with the MariSilicon X ISP, as per tipster DigitalChatStation.
As per the tipster, one phone in the upcoming series carries the codename PGAM10, which kind of elaborates on what we already know, such as a 6.55″ OLED display with a refresh rate of 120Hz, a 50MP primary IMX766 shooter along with an 8MP ultra-wide sensor, and a 2MP module. On the front, it has a 32MP selfie shooter.
The phone is set to have an in-display fingerprint sensor and will pack a 4,500mAh battery with 80W fast charging.
The device will have the Snapdragon 7 Gen1 chip with LPDDR5 RAM and UFS 3.1 storage. The upcoming chip will have four Cortec-A710 and A510 cores, it does skip out on the fast X2 core that the Snapdragon 8 Gen1 chip has. In addition to this, it will also feature a last-gen GPU, the Adreno 662 (the 8 Gen1 utilizes the Adreno 730).
The MediaTek chip that will be featured in the other Oppo Reno8 models is not yet confirmed, but we can hope that it will be the Dimensity 8000/8100 as they are the closest to the Snapdragon. They feature the older version A78 and A55 cores and a new Mali-G610 GPU. The Dimensity 9000 is also a chip we can expect to see, it has the perfect flagship lineup of X2 core, A710 and A510, and a higher-end Mali-G710.
Oppo could release the Reno8 Series next month, a year after the first Reno6 models went official, this means that the model named PGAM10 could be the first phone to carry the Snapdragon 7 Gen1 chip.
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