Recently we saw the first-ever leaked images of the Intel LGA 1800 socket, along with some more details of the Intel LGA 1700 model. Both of these are designed for Intel’s next-generation CPUs including the upcoming Alder Lake desktop family.
Now some additional details have been leaked online about both these upcoming sockets and it suggests that they will power at least two generations of CPUs and could be extended to further support the next-gen.
The Intel LGA 1700 & LGA 1800 sockets will support at least two generations, Alder Lake & Raptor Lake. But Intel is yet to make anything clear as to what LGA 1800 is designed for. Many speculations suggest that it could be specific to the Xeon-W platform or it is designed for the very first 7nm processors arriving in 2023 with Meteor Lake.
we know that the Alder Lake desktop CPUs will come in a 37.5×45.0mm package and will be supported by the ‘V0’ socket which we know as LGA 1700. So that suggests that at least the 1700 model will be targeted towards Alder Lake. The latest reports also indicate that the CPU coolers on the new socket must be mounted properly over the CPU and it must be confirmed with the vendors before installation.
There is also the fact that new and refreshed mounting brackets need to be shipped by cooler manufacturers for Intel Alder Lake and LGA 1700 support. let’s see what new ideas will the costume manufacturers like MSI will come up with for the liquid coolers supporting the Alder Lake.
Intel LGA1700 Socket details
| IHS to MB Height (Z-Stack, validated range): | 6.529 – 7,532 mm |
| Thermal Solution Hole Pattern: | 78 x 78 mm |
| Socket Seating Plane Height: | 2.7 mm |
| Maximum Thermal Solution Center of Gravity Height from IHS: | 25.4 mm |
| Static Total Compressive Minimum: | 534N (120 lbs), Beginning of Life 356 N (80 lbf) |
| End of life maximum: | 1068 N (240 lbf) |
| Socket Loading: | 80-240 lbf |
| Dynamic Compressive Maximum: | 489.5 N (110 lbf) |
| Maximum Thermal Solution Mass: | 950 gm |
| Important Note: | A Keep In Zone is introduced for LGA17xx-18xx thermal solutions. Two volumes are provided. The Asymmetric volume provides the maximum available design space. The Symmetric volume provides for designs to be rotatable on the board. The thermal solution under load should fit within the volume |
