The Taiwanese Silicon giant has launched a new Dimensity 5G SoC for mid-range smartphones to compete with Qualcomm’s Snapdragon 765G or the newer 768G. Based on TSMC’s 7nm process, the new Dimensity 820 5G SoC is an upgrade over its originally announced Dimensity 800 SoC.
With this new SoC MediaTek plans to bring better performance to the mid-ranged smartphones and ultimately make 5G more accessible. The architecture behind the chip is quite similar to the Dimensity but now with greater clock speeds.
Our Dimensity 1000 is already powering impressive flagship 5G devices in a number of markets. With the new Dimensity 820, we’re now making 5G much more accessible
Dr. Yenchi Lee, Assistant General Manager of MediaTek’s Wireless Communications Business Unit
The Dimensity 820 5G SoC is an octa-core SoC with  four high-performance Arm Cortex-A76 cores running at 2.6GHz, which is significantly higher than Dimensity 800’s clock speed of 2.0GHz. While the other four efficiency Cortex-A55 cores continue to be clocked at 2.0GHz.
On the graphics front, the SoC features 5-core Arm Mali G57 GPU which is an upgrade over a quad-core GPU on the Dimensity 800. MediaTek’s HyperEngine 2.0 enhancements help gamers to enjoy the games without lag.
The MediaTek Dimensity 820 supports FHD+ 120Hz high frame-rate displays along with HDR10 support. Also, the MediaTek MiraVision feature showcases the most vivid visuals in videos and streams. On the camera front, the chipset supports up to 80MP cameras, an upgrade from 64MPÂ support along with quad-camera support on the rear-end.
Coming to connectivity, the integrated 5G NR (sub-6GHz) modem supports both the standard and non-standard sub-6GHz 5G networks. It also comes with MediaTek’s 5G UltraSave technologies, including exclusive 5G UltraSave Network Environment Detection and 5G UltraSave OTA Content Awareness to increase efficiency and battery life.
The Dimensity 820 will soon be seen on Redmi’s next smartphone with 5G support and in second half of 2020 we will get to see more of this SoC powering the next mid-ranged devices.
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