MediaTek unveiled the Dimensity 8300, a new mid-range chipset positioned to rival Qualcomm’s recently released Snapdragon 7 Gen 3. Similar to the company’s latest flagship, the Dimensity 9300, this new chipset incorporates on-device generative AI capabilities and adopts an ‘all-big-core design.’
All About the MediaTek Dimensity 8300
Manufactured using TSMC’s 2nd generation 4nm process, the Dimensity 8300 features an octa-core CPU composed of 4 ARM Cortex-A715 cores paired with 4 ARM Cortex-A510 cores. MediaTek asserts that this chipset delivers a 20% performance boost and consumes 30% less power compared to its predecessor.
Regarding the GPU, the Dimensity 8300 houses the Mali-G615 MC6 GPU, offering a 60% increase in performance while consuming 55% less power. Similar to the recently launched Snapdragon 8 Gen 3, the new MediaTek chipset includes a dedicated APU 780 AI processor capable of running generative AI models with up to 10 billion parameters on the device itself.
MediaTek has also enhanced the maximum RAM speed support from 6400MHz to 8300MHz, potentially resulting in a roughly 33% improvement in multitasking. In comparison to the Dimensity 8200, which supports UFS 3.1 storage, the new chipset introduces support for the latest standard, UFS 4.0.
A significant improvement is the ability to record 4K videos at 60fps, aligning with the capabilities of the Snapdragon 7 Gen 3. MediaTek has also introduced a new feature allowing users to simultaneously record 4K HDR videos on two cameras, along with ‘flagship-grade video noise reduction’ and an AI-Color Content Smart ISP.
In the gaming realm, the Dimensity 8300 now incorporates MediaTek’s ‘Adaptive Game Technology 2.0’ and Modem Express 2.0, enhancing chipset cooling while delivering a high FPS, lag-free gaming experience.
Turning to the modem, MediaTek states that the new processor can achieve peak download speeds of up to 5.17Gbps on 5G networks and features Wi-Fi 6E support, doubling the bandwidth compared to the previous generation. The first smartphones powered by the Dimensity 8300 chipset are anticipated to launch in December 2023.