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MediaTek Dimensity 8300: A Mid-Range Powerhouse

MediaTek unveiled the Dimensity 8300, a new mid-range chipset positioned to rival Qualcomm’s recently released Snapdragon 7 Gen 3. Similar to the company’s latest flagship, the Dimensity 9300, this new chipset incorporates on-device generative AI capabilities and adopts an ‘all-big-core design.’

MediaTek Dimensity 8300

All About the MediaTek Dimensity 8300

Manufactured using TSMC’s 2nd generation 4nm process, the Dimensity 8300 features an octa-core CPU composed of 4 ARM Cortex-A715 cores paired with 4 ARM Cortex-A510 cores. MediaTek asserts that this chipset delivers a 20% performance boost and consumes 30% less power compared to its predecessor.

Regarding the GPU, the Dimensity 8300 houses the Mali-G615 MC6 GPU, offering a 60% increase in performance while consuming 55% less power. Similar to the recently launched Snapdragon 8 Gen 3, the new MediaTek chipset includes a dedicated APU 780 AI processor capable of running generative AI models with up to 10 billion parameters on the device itself.

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image 636 MediaTek Dimensity 8300: A Mid-Range Powerhouse

MediaTek has also enhanced the maximum RAM speed support from 6400MHz to 8300MHz, potentially resulting in a roughly 33% improvement in multitasking. In comparison to the Dimensity 8200, which supports UFS 3.1 storage, the new chipset introduces support for the latest standard, UFS 4.0.

A significant improvement is the ability to record 4K videos at 60fps, aligning with the capabilities of the Snapdragon 7 Gen 3. MediaTek has also introduced a new feature allowing users to simultaneously record 4K HDR videos on two cameras, along with ‘flagship-grade video noise reduction’ and an AI-Color Content Smart ISP.

image 637 MediaTek Dimensity 8300: A Mid-Range Powerhouse

In the gaming realm, the Dimensity 8300 now incorporates MediaTek’s ‘Adaptive Game Technology 2.0’ and Modem Express 2.0, enhancing chipset cooling while delivering a high FPS, lag-free gaming experience.

Turning to the modem, MediaTek states that the new processor can achieve peak download speeds of up to 5.17Gbps on 5G networks and features Wi-Fi 6E support, doubling the bandwidth compared to the previous generation. The first smartphones powered by the Dimensity 8300 chipset are anticipated to launch in December 2023.

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