Intel has taken a significant step forward in the AI era, launching the Intel Foundry – a sustainable systems foundry business strategically designed for AI applications. This announcement was made at the company’s inaugural foundry event, Intel Foundry Direct Connect, highlighting an expanded process roadmap aimed at establishing leadership well into this decade.
Intel Launches World’s First Systems Foundry Designed for the AI Era
Accelerating Chip Designs with Ecosystem Partners
Intel Foundry’s launch has been buoyed by the support and customer momentum from various ecosystem partners, including Synopsys, Cadence, Siemens, and Ansys. These partners are ready to fast-track Intel Foundry customers’ chip designs with tools, design flows, and IP portfolios validated for Intel’s advanced packaging and Intel 18A process technologies.
Extended Process Roadmap Beyond 5N4Y
Intel’s extended process technology roadmap introduces Intel 14A to the company’s cutting-edge node plan, alongside several specialized node evolutions. The ambitious five-nodes-in-four-years (5N4Y) process roadmap remains on schedule, promising to deliver the industry’s first backside power solution. Leadership at Intel anticipates that the company will regain process leadership with Intel 18A by 2025.
The company also announced the addition of Intel Foundry FCBGA 2D+ to its comprehensive suite of ASAT offerings, which already include FCBGA 2D, EMIB, Foveros, and Foveros Direct.
Microsoft’s Support for Intel Foundry
The long-term systems foundry strategy of Intel has received strong support from customers, with Microsoft Chairman and CEO Satya Nadella endorsing the approach during Pat Gelsinger’s keynote. Nadella unveiled Microsoft’s commitment to Intel Foundry, revealing their choice of a chip design intended for production using the Intel 18A process.
Highlighting a transformative platform shift, Nadella emphasized the need for reliable access to advanced, high-performance semiconductors. Intel Foundry’s success spans various process generations, including Intel 18A, Intel 16, and Intel 3, with substantial customer volume utilizing Intel Foundry ASAT capabilities and advanced packaging. The expected lifetime deal value for Intel Foundry, covering wafer and advanced packaging, exceeds $15 billion.
Readiness of IP and EDA Vendors for Intel Process and Packaging Designs
Intellectual property and electronic design automation (EDA) partners Synopsys, Cadence, Siemens, Ansys, Lorentz, and Keysight have disclosed tool qualification and IP readiness. This will enable foundry customers to accelerate advanced chip designs on Intel 18A, which offers the foundry industry’s first backside power solution. These companies also affirmed EDA and IP enablement across Intel node families.
