Intel has yet to release a detailed roadmap for its next-generation Xeon CPUs, and while they have highlighted their next-generation devices, we don’t know much about them, whereas AMD has released preliminary numbers for its EPYC 5nm portfolio. So, with the help of their sources and a little speculation, The Next Platform has created its roadmap that covers Intel’s Xeon series up till Diamond Rapids.
To be safe, keep in mind that TheNextPlatform’s specifications and information are primarily guesses based on rumors and speculation, as well as clues from their sources. Take these specs with a grain of salt because they haven’t been validated by Intel. They do, however, provide us with some insight into where Intel’s next-generation lineups might go.
The SOC will be powered by the Golden Cove core architecture, which will also power the Alder Lake range. The blue team intends to deliver up to 56 cores and 112 threads with a maximum TDP of 350W. AMD’s EPYC Genoa CPUs, on the other hand, will have up to 96 cores and 192 threads with a TDP of up to 400W. AMD would also have a significant advantage in terms of cache capacity, IO capabilities, and other features (higher PCIe lanes, higher DDR5 capacities, higher L3 cache).
The Sapphire Rapids-SP will be available in two package configurations: regular and HBM. The regular edition will come with a chiplet design made up of four CXC dies with a die size of roughly 400mm2. This is the die size for a single CXC die, and the Sapphire Rapids-SP Xeon processor will have four in total. Each die will be linked together using the EMIB protocol, which has a pitch of 55u and a core pitch of 100u.
Intel is aiming for at least 16 GB of HBM2E memory per stack over the four HBM2E memory packages, for a total of 64 GB across the Sapphire Rapids-SP package. When it comes to the box, the HBM variant will be 5700mm2 in size, which is 28% larger than the normal variant. The HBM2E package for Sapphire Rapids-SP would be 5% larger than the recently released EPYC Genoa statistics, while the normal package would be 22% smaller.
- Intel Sapphire Rapids-SP Xeon (Standard Package) – 4446mm2
- Intel Sapphire Rapids-SP Xeon (HBM2E Package) – 5700mm2
- AMD EPYC Genoa (12 CCD Package) – 5428mm2
The highest SKU is projected to have up to 2.3 GHz base frequencies, 4 TB of DDR5 memory capacity, 80 PCIe Gen 5.0 lanes, and a max power of 350W, according to the next platform. The Sapphire Rapids-SP Xeon series would provide up to a 66 percent performance boost over Ice Lake-SP chips, as well as a 25.9% performance/price boost.
In comparison to typical package designs, Intel claims that the EMIB link provides twice the bandwidth density and four times the power efficiency. Intel’s newest Xeon processors are dubbed “Haswell.” Logically monolithic means that they’re referring to the interconnect, which will provide the same functionality as a single-die, but technically there will be four chiplets joined together.
Within the server category, AMD’s Zen-powered EPYC CPUs have reversed the tides, but it appears like Intel is planning a comeback with its forthcoming Xeon CPU family. Emerald Rapids, the company’s first-course correction, is set to launch in Q1 2023.
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