Technology
AMD’s Medusa Point APUs May Stick with RDNA 3.X Instead of RDNA 4 or 5
AMD’s next-gen Medusa Point APUs, set to feature the powerful Zen 6 architecture, might not be upgrading to RDNA 4 or RDNA 5 for...
Intel’s $28 Billion Ohio Chip Factories Delayed to 2030
Intel, once the undisputed leader in semiconductor innovation, has been facing a turbulent few years. In its bid to regain dominance, the company announced...
China’s DeepSeek Claims 545% Daily Profit Ratio – Disrupting the AI Market?
In a surprising revelation, Chinese AI startup DeepSeek has unveiled data suggesting a staggering 545% theoretical cost-profit ratio per day for its cutting-edge AI...
AMD AERITH Plus SoC: A Powerhouse Upgrade for Steam Deck 2?
AMD is reportedly preparing a next-generation AERITH Plus SoC, designed to push the performance boundaries of handheld gaming. This upgraded chip is expected to...
WhatsApp is going to impose new Forwarding Limit Rule
As the maximum World is in the lockdown mode, people become more active on social media. This is the only way to stay connected...
AMD Ryzen 9 4900U APU appears on UserBenchmark
The Red team's product lineup doesn't seem over yet, a couple of months ago the Ryzen 9 4900U was spotted in the datasheet for...
PatchWall 3.0 Update is out in India for Mi TVs
A long Xiaomi product list is there in India. It is the no. 1 Smart TV Brand in India and highly responsible for the...
Huawei’s new Kirin 985 SoC spotted, falls behind Dimensity 1000 in...
A new SoC from Huawei spotted, named the Kirin 985 has appeared on AI Benchmark - only to be beaten immediately by the Dimensity 1000. The alleged...
OnePlus may launch Wrap Charge 30 Wireless Charger with Cooling Fan
The OnePlus 8 series is going to launch globally next week on 14th April. In the series, OnePlus 8 Pro is expected to come...
3nm Chip Production of Samsung got delayed due to COVID-19
Another big bump in the road of Samsung due to Coronavirus pandemic around the world. Like several other smartphone brands, Samsung has also faced...
