Technology
Dimensity 8400 Ultra vs Snapdragon 8s Gen 3: Benchmark Showdown
In the world of premium smartphone chips, the battle between MediaTek’s Dimensity 8400 Ultra and Qualcomm’s Snapdragon 8s Gen 3 is heating up. Both...
Intel’s Panther Lake and Nova Lake CPUs: What to Expect in 2025 and 2026
Intel is gearing up for some major launches with its Panther Lake and Nova Lake processors, which promise to set new benchmarks in performance...
Apple Intelligence to Support 9 Languages in April 2025
Apple Intelligence, the AI-powered feature introduced with the iPhone 16 series, is set to expand its language support in April 2025. Apple Intelligence, which...
AMD Ryzen 9000X3D & Radeon RX 9070 GPUs Launching by March
AMD is gearing up for a major hardware launch by the end of Q1 2025, with its highly anticipated Ryzen 9000X3D CPUs and Radeon...
Redmi Note 7S : The “48MP for everyone” is launched.
Redmi Note 7s is the upgraded version of the Redmi Note 7 and the cheapest smartphone with 48MP camera sensor.
Redmi India has launched the...
Top 10 Smartphones to play PUBG under Rs.10,000 in India |...
Best smartphones which are worth buying under a budget of Rs.10,000 in India this year for playing PUBG.
Here is the list of the top...
AMD EPYC Rome CPU benchmarks leaked
AMD's upcoming server end EPYC 7nm processors are on the verge of its release in the coming months, and they already have sent the...
AMD to power World’s Fastest Super Computer – Frontier
U.S. Department of Energy, Oak Ridge National Laboratory, and Cray Inc to build the World's Fastest Super Computer - Frontier, in collaboration with AMD
It's...
AMD Ryzen 3000 CPUs will boost up to 4.5GHz with 15%...
As the release of the new gen Ryzen 3000 CPUs getting closer, more and more rumours are flooding in the air. The Zen 2...
TSMC unveils its new 6nm chip manufacturing process
Taiwanese semiconductor manufacturing giant TSMC announces 6nm chip manufacturing process, a cost-effective enhancement of its industry-leading 7nm tech
In the past few years, TSMC is...
