Igor’s Lab claims to have obtained a PCB layout for AMD’s top-of-the-line Radeon RX 7900 XT graphics card, which allegedly uses the RDNA 3 Navi 31 GPU. The graphics card will provide a significant power improvement over AMD Radeon RX 6900 XT graphics cards that are based on RDNA 2.
Igor Wallossek’s PCB leak closely resembles the AMD Radeon RX 7900 XT graphics card’s reference design. Two 8-pin connectors were reportedly present on the flagship RDNA 3 Navi 31 GPU, but this PCB appears to be a little different. It’s possible that AMD will use a different board for its own use and that this is a partner/AIC reference board.
Let’s start by examining the Navi 31 “RDNA 3” GPU, which is located in the centre of the PCB and is said to have 7 chiplets (1 GCD + 6 MCDs). The entire package area is projected to be 225mm2, with the GCD measuring 308mm2 and the MCDs measuring 37.5mm2 each. That completely fills a 538 mm2 die size. Twelve GDDR6 memory modules, each with a capacity of up to 24 GB using 16GB DRAM, surround the MCM GPU.
Regarding power delivery, it is said that the AMD Radeon RX 7900 XT “Navi 31” graphics card uses a 21+3 phase power delivery solution made up of 16 voltage converters (from 8 phases running in parallel).
This alone represents a significant improvement over the Radeon RX 6900 XT’s 16 phases, and as a result, the power need has increased. This PCB has triple 8-pin connectors rather than twin 8-pin connectors. Although the card is advertised as having a maximum board power or TBP of 450W, the actual value would be less.
Starting with the RDNA generation, AMD has always attempted to take a more uniform approach with its PCB and cooling designs, and the Radeon RX 7000 series would also be adhering to these pillars.
The Radeon RX 7900 XT graphics card and other next-generation enthusiast cards would be powered by the AMD Navi 31 GPU, the top-tier RDNA 3 processor. We’ve heard that AMD would replace its next-generation RDNA 3 GPUs’ compute units with work group processors. Dual CU (Compute Units) will be housed in each WGP, but there will be four SIMD32 clusters per CU, as opposed to two on each CU in RDNA 2. According to rumours, AMD has the choice of the 6nm die from TSMC or Samsung.
The AMD Navi 31 GPU with RDNA 3 architecture is anticipated to feature a single GCD with 48 WGPs, 12 SAs, and 6 SEs, according to the most recent information. There will be a total of 12,288 stream processors distributed as a result. This represents a 2.4x increase in cores above the 5120 SPs found in the Navi 21 GPU. According to reports, the Navi 31 GCD, often known as the GPU, would be packaged on TSMC’s 5nm production node and measure 308mm2.
The Navi 31 GPU will also include 6 MCDs, each of which will have a 16 MB Infinity Cache. Additionally, these MCDs are anticipated to include 64-bit (32-bit x 2) memory controllers, giving the device a 384-bit bus interface.
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