MediaTek Dimensity 7400 and Dimensity 7400X Unveiled with AI and 5G

MediaTek has officially unveiled its Dimensity 7400 and Dimensity 7400X chipsets, succeeding last year’s Dimensity 7300 series. The new chipsets include improved AI processing, gaming, and overall efficiency, making them the best in their classes on mobile devices. Both processors are based on TSMC’s 4nm process and sport an octa-core CPU featuring four Cortex-A78 cores with a clock speed of 2.6GHz and four Cortex-A55 cores at 2.0GHz. This configuration allows you to have a balance of power and efficiency in everyday tasks down to intensive apps.

MediaTek Dimensity 7400 and Dimensity 7400X Unveiled: AI, Gaming & 5G Upgrades Coming in 2025

For graphics, there is a Mali-G615 MC2 GPU capable of 3D graphics in gaming scenarios, and it supports LPDDR5 and LPDDR4X RAM memory with speeds of up to 6400Mbps. These chipsets also feature support for UFS 3.1 and UFS 2.2 storage which allows data transfers at much higher speeds. Connectivity is robust, featuring 5G with 3CC carrier aggregation and peak downlink speeds of 3.27 Gbps, along with Wi-Fi 6E and Bluetooth 5.4 for seamless wireless performance.

Further enhancing its imaging prowess, the Dimensity 7400 series features the Imagiq 950 ISP, which processes camera input up to 200MP and recording of 4K HDR video at 30fps. These machines come equipped with AI-assisted autofocus, electronic image stabilization (EIS), and hardware-based face detection. Providing crisp visuals, the MiraVision 955 display engine supports WFHD+ at 120Hz and Full HD+ at 144Hz for buttery smooth screen performance.

The APU 655 upgrade further enhances AI processing with a 15 percent performance improvement. The UltraSave 3.0+ technology can cut gaming power consumption by up to 36%, and Google’s Ultra HDR delivers a more dynamic range with a wider palette of colors in both photos and videos.

The two chipsets have quite a lot of shared features, but the Dimensity 7400X is tailored for foldable devices, with extra power management capabilities for improved multi-screen usage of these devices. The normal Dimensity 7400 is meant for regular smartphones. Smartphones and foldables powered by these chipsets are expected to arrive in Q1 2025, promising improved gaming, AI, and battery efficiency in the next generation of smartphones and foldables.

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