Honor is said to be in the process of developing its flagship Honor Magic 6 series of smartphones, with confirmation that the Snapdragon 8 Gen 3 chipset will be featured. Speculation suggests that the series might be unveiled in January 2024 in China, as indicated by a circulating poster on Weibo detailing the rumored specifications of the Magic 6 Pro. Here is a summary of the information disclosed in the leak.
More About the Honor Magic 6 Pro
The leaked details indicate that the upcoming Honor Magic 6 Pro will boast an “Oasis” OLED display, delivering a resolution close to 2K. It will showcase a pill-shaped cutout, housing dual front-facing cameras and advanced sensors for 3D face unlock, gesture operation, and eye tracking.
Operating on the new Magic OS 8.0, based on Android 14, the Honor Magic 6 Pro will introduce the Smart Island notifications feature. Powered by the Snapdragon 8 Gen 3, the device will include a dedicated graphic chip and an integrated security chip. Notably, the Magic 6 Pro will integrate a substantial AI model with an impressive 7 billion parameters, enhancing its capabilities in artificial intelligence applications.
Equipped with a second-generation Qinghai Lake battery (specific size undisclosed), the Magic 6 Pro will support satellite communication. Its design features a rear shell made from sleek nano-ceramic glass, contributing to a premium aesthetic, while an IP68 rating ensures resistance against dust and water. In the photography department, the Magic 6 Pro will feature the one-inch 50-megapixel OmniVision OV50k primary camera with variable aperture support.
The Honor Magic 6 Pro is slated to debut in late January 2024, initially launching in China. A purported Magic 6 phone, identified by the BVL-AN00 model number, recently appeared on the 3C certification platform with a 100W fast charger. It is anticipated that the global release may occur in late Q1 or Q2 2024.
