Vivo X100 Series Set to Feature MediaTek Dimensity 9300 Chipset

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Chinese smartphone manufacturer Vivo has officially announced the launch of its latest flagship series, the X100 series, in the country. The series includes two smartphones, namely the Vivo X100 and X100 Pro. In a recent update on the Chinese social media platform Weibo, Vivo disclosed several details about the upcoming X100 series.

Vivo X100 Series

The Upcoming Vivo X100 Series with MediaTek Dimensity 9300

The smartphones will be available in four color options: white, orange, blue, and black. Notably, the X100 series will feature a telephoto camera and will be equipped with Vivo’s own V3 imaging chipset. Zeiss is responsible for developing the camera on the X100 series. Additionally, both phones in the series will be powered by the octa-core MediaTek Dimensity 9300 chipset, a fact confirmed when the X100 series appeared on Geekbench with a single-core score of 2256 and a multi-core score of 7632.

As for the specifications of the Vivo X100 Pro, it is expected to debut with an impressive 6.78-inch AMOLED display offering a 1.5K resolution, a speedy 120Hz refresh rate, and an in-screen fingerprint sensor for enhanced security. Under the hood, the X100 Pro will be powered by the Dimensity 9300 chipset, accompanied by a generous 16 GB of LPDDR5T RAM and capacious 1 TB UFS 4.0 storage.

In the battery department, the X100 Pro is anticipated to feature a substantial 5,400mAh battery with the remarkable capability of 120W wired charging, and it’s rumored to support 50W wireless charging as well. The device will come with Origin OS 4, based on the latest Android 14.

The camera setup of the X100 Pro is quite impressive, with a 50-megapixel primary camera featuring the Sony IMX989 sensor with optical image stabilization (OIS), a 50-megapixel ultra-wide lens, a 64-megapixel OmniVision OV64B periscope telephoto camera, and the Vivo V3 ISP. Selfie enthusiasts will also be pleased with a 32-megapixel front-facing camera for capturing stunning self-portraits.

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