Despite facing severe setbacks which were caused by the chip shortage, TSMC is positive that it will continue to mass-produce wafers boasting smaller lithography to push the boundaries of its chip development.
According to sources, the chip manufacturer is expected to start volume production of its enhanced 3nm node in the second half of 2023. and reports suggest that TSMC will also be manufacturing its new enhanced 3nm wafers dubbed as the N3E, though the game is not confirmed.
In earlier reports, TSMC stated that there will be a delay in the production of its 3nm chip and the mass production will begin in 2022. this means that Apple will not have access to the latest and greatest technology and would instead have to rely on the Taiwanese chipmaker’s 4nm technology.
However, according to the latest reports, TSMC is on track to commence volume production of 3nm chips in H2, 2022, meaning that Apple’s A16 Bionic for the iPhone 14 lineup could be mass-produced on the new 3nm architecture without delay.
Apple is also said to have secured the initial 3nm chip orders from TSMC to gain a lead against the competition, however, considering the ongoing chip shortage it’s not known as to how much of a premium Apple would have to pay to get such shipments from TSMC. But, the extra premium which the Cupertino giant has to pay to get the shipments will be reflected in the price of the new iPhones.
In other news, Samsung is on route to reduce the technological gap between its biggest chipmaking rival with its own 3nm technology. And the South Korean tech giant is expected to begin mass production in H1, 2022.
