Prior rumours that TSMC might switch from its 3nm (N3) process to the more sophisticated N3E variation have been refuted by the CEO of the chip manufacturing company, who stated that mass production will go as planned. The most recent news gives Apple’s ambitions to build its future M2 Pro and M2 Max on the next-generation architecture more momentum.
According to a story on Economic News Daily, TSMC CEO C. C. Wei has made comments regarding the difficulties of mass producing 3nm wafers. He asserts that the largest obstacle is a staffing scarcity for 3nm R&D, which the company is working to address. We assume that Apple would be one of the numerous clients that are enthusiastic about TSMC’s N3 technology, as stated by Wei.
According to reports, TSMC currently employs over 2,000 people in its 3nm R&D division, with plans to hire more personnel in the future.
It was previously reported that Apple’s M2 Pro and M2 Max were mass produced using TSMC’s 5nm process, which suggested that the company’s 3nm node was either having issues or had been completely abandoned in favour of the enhanced N3E. It appears that TSMC has everything set up to ensure that it delivers orders for a variety of clients, including the iPhone manufacturer.
Unfortunately, because the M2 Pro and M2 Max continue to follow the same mass production schedule as previously anticipated, even if Apple has enough batches of its next-generation CPUs ready, the revised 14-inch and 16-inch MacBook Pro models won’t use them until the following year. Only the M2 Max’s specifications are known, and Apple’s top-tier silicon supports configurations with up to a 12-core CPU and 38-core GPU.
A17 Bionic, which will only be utilised for the iPhone 15 Pro and iPhone 15 Pro Max, is one of Apple’s upcoming devices that will benefit from TSMC’s 3nm technology. We suggest our readers to wait for additional information about Apple’s future plans.
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