TSMC and Samsung face hurdles in 3nm process development

As 2021 has stepped in, we ought to demand more from the previous year, our progress in tech has been amazing throughout the last decade and is expected to be even better in the next decade. Also, one cannot forget the contribution of semiconductor foundries in the world who are making this evolution possible.

A recent report from Digitimes says that the two biggest semiconductor contract manufacturers – TSMC and Samsung are developing the next-gen 3nm process node, which is said to come into the market in the next 2 years.

As per the report: The foundries may have to delay moving their respective 3nm process to volume production. In China, distributors of chip resistors have raised their prices reportedly to reflect unstable supplies from the manufacturing side.

Taiwanese PCB makers remain upbeat about demand in first-quarter 2021 but are conservative beyond that, judging from uncertain developments arising from a number of factors, such as the momentum from the stay-at-home economy.

It seems the development of these upcoming 3nm nodes is facing resistance from distributors of chip resistors in China because of the unstable supplies from the manufacturers. So, although the development might see some issues, 3nm will indeed be coming in a few years and with time both TSMC & Samsung could give some insights into their progress.

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