In an exciting development for the tech world, Tessolve, a global leader in silicon solutions, has announced a strategic partnership with SigmaSense to pioneer an innovative DSP-based sensing ASIC. This new mixed-signal ASIC features a state-of-the-art, low-power touch-sense controller chip that’s seamlessly integrated with SigmaSense’s revolutionary software-defined sensing technology.
Tessolve Partners with SigmaSense to develop their Innovative DSP-based Sensing ASIC
The newly developed touch-sense controller chip redefines the realm of touch and touch-less interaction with its groundbreaking performance in sensitivity, refresh rates, and signal-to-noise ratio. Overcoming the challenges posed by slimmer displays and high capacitive loads, this chip enables continuous and precise high-impedance sensing, providing a seamless user experience.
The chip’s versatility spans numerous applications, including automotive, gaming, consumer electronics, and computing sectors. SigmaSense customers can expect unparalleled sensitivity and ultra-low power consumption, even in the most demanding environmental conditions. The chip’s proprietary digital signal processing solution further enhances programmability, ensuring an optimal user experience.
“By leveraging our expertise in pre-silicon design and post-silicon test, we’ve developed a touch sense control solution that facilitates a smooth development process. This comprehensive approach effectively addresses the hurdles of conventional methods, resulting in faster time-to-market and enhanced quality for next-generation chip design,” stated Srini Chinamilli, Co-founder & CEO of Tessolve. “At Tessolve, we specialize in design and engineering services with a focus on the seamless integration of various intellectual properties (IPs) into SOCs. This initiative prioritizes stringent power demands through the integration of SigmaSense’s Analog IP and DSP IP into a powerful sensing SOC tailored for 40nm specifications.”
Tessolve has capitalized on SigmaSense’s groundbreaking sensing technology to innovate their product designs. By swiftly deploying its IC Design and Methodology teams from RTL to GDS, Tessolve successfully integrated the revolutionary Analog and Mixed Signal technology, achieving successful first-pass silicon.
Tessolve enhances time-to-market efficiency by providing comprehensive ASIC development services, including Digital and Analog Design, as well as post-silicon bring-up and validation. To optimize both cost and schedule, Tessolve employs a hybrid staffing model that combines onsite engineering in Austin with a larger team based in Bengaluru. Utilizing their Austin-based test lab, Tessolve expedited ATE Test Development, facilitating a faster production ramp for the SDC300.
“Collaborating with Tessolve aligns perfectly with our vision of revolutionizing touch and sensing technology,” remarked Dave French, CEO of SigmaSense. “Their expertise in silicon design and systems solutions was instrumental in bringing our innovative sensing ASIC to life. Our software-defined sensing technology offers superior sensitivity, low power consumption, and high performance across various applications. We are confident that this advanced microcontroller will significantly transform user experiences across multiple sectors.”
In summary, the partnership between Tessolve and SigmaSense is set to transform the landscape of touch technology, delivering unparalleled user experiences and setting new standards in the industry.
