Foxconn, Thales, and Radiall have launched Tessalia, a massive joint venture in

France. This OSAT facility aims to revolutionize European tech sovereignty. By 2033,

they’ll churn out 50 million advanced System in Package (SiP) units annually.

Targeting aerospace, automotive, and medical sectors, this high-density packaging hub slashes reliance

on global chains, securing Europe’s future as a global semiconductor titan.