US Sanctions

Huawei patents new 3D Chip Stacking technology to escape from US Sanctions

Huawei has invented (and patented) a chip stacking technology that is expected to be far less expensive than current chip stacking processes. The technology...
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Nivedita Bangari

Huawei patents new 3D Chip Stacking technology to escape from US...

Huawei has invented (and patented) a chip stacking technology that is expected to be far less expensive than current chip stacking processes. The technology...