US Sanctions

Huawei patents new 3D Chip Stacking technology to escape from US Sanctions

Huawei has invented (and patented) a chip stacking technology that is expected to be far less expensive than current chip stacking processes. The technology...
News
Nivedita Bangari

Huawei patents new 3D Chip Stacking technology to escape from US...

Huawei has invented (and patented) a chip stacking technology that is expected to be far less expensive than current chip stacking processes. The technology...