Intel Foveros 3D Chip Facility

Intel Launches $3.5 Billion Foveros 3D Chip Packaging Facility in New Mexico: Pioneering Advanced Semiconductor Production

On Wednesday, Intel made a significant announcement regarding the commencement of operations at Fab 9, located in Rio Rancho, New Mexico. This state-of-the-art production...
Technology
Ishika Setia

Intel Launches $3.5 Billion Foveros 3D Chip Packaging Facility in New...

On Wednesday, Intel made a significant announcement regarding the commencement of operations at Fab 9, located in Rio Rancho, New Mexico. This state-of-the-art production...