Samsung is revolutionizing AI hardware by integrating Galaxy S26 thermal tech into its next-gen HBM5 memory.

Aiming for mass production by 2026, this crossover targets 1 TB/s bandwidth per stack.

By applying smartphone-grade vapor chambers to data center chips, Samsung is aggressively tackling thermal throttling.

It’s a bold, futuristic strategy to maximize cooling efficiency and dominate the global AI infrastructure market.