Samsung has decided to incorporate cutting-edge packaging technology by focusing on research and development efforts to implement “Glass Substrate” technology by 2026.
All About Samsung Glass Substrate Chip Production
While Glass Substrate technology is not entirely new, in the semiconductor industry Intel initially paved the way for its development years ago. Despite Intel’s push for this technology they expect that large-scale production may not be achievable until 2030 despite making investments in their Arizona plant. In light of this anticipated delay, Samsung has stepped in to accelerate the adoption and mass production of Glass Substrate chips.
The renowned Korean company Samsung has assigned its subsidiary, Samsung Electro-Mechanics, the task of spearheading research projects to delve into the applications of glass substrates, in fields like intelligence (AI) and other emerging technologies. Furthermore, Samsung intends to tap into the knowledge from departments, including their display division to encourage an approach to advancing glass substrate technology.
The utilization of glass substrates marks a shift in computer chip packaging by providing solutions to address limitations associated with packaging methods. This technology offers advantages such as enhanced packaging strength for durability and reliability along with a density of interconnections due to the sleeker profile of glass compared to materials. The slim design permits the integration of transistors in a unit creating opportunities for improving chip architecture and efficiency.
Although Glass Substrate technology displays potential the progress in its development has not been as successful impeding its adoption in the industry. Nevertheless, Samsung seems to acknowledge the possibilities of glass substrates prompting the company to coordinate an effort aimed at expediting the integration of this technology by leveraging the combined expertise of its key subsidiaries.
Reports suggest that Samsung Electro-Mechanics is targeting the start of production of glass substrates by 2026 indicating a near-term milestone. The industry is excited to see if this new packaging technique will become popular and potentially replace methods, in the semiconductor field.
