At the end of this year, Qualcomm will be launching its next true flagship SoC Snapdragon 875 based on a refined 5nm process from TSMC. Now, we have some details about the next-gen mobile platform.
According to tipster Roland Quandt, the upcoming Snapdragon 875 (SM8350) will adopt the internal codename Lahaina. Well, this name has originated from a city in Maui, one of the seven Hawaiian Islands.
Previously we had a leaked roadmap about Qualcomm’s next launches wherein it was said that the chip will be the Snapdragon 875G instead of Snapdragon 875. However, this remains a point of further investigation, but as for now, we can call it Qualcomm SD875.
The Snapdragon 875 will also be a 5G chipset and will come withĀ a ā1+3+4ā triple cluster architectureĀ that consists of 1 x high-performance Cortex-X1 core + 3 x Cortex-A78 cores + 4 x energy-efficient Cortex-A55 cores.
The ARM Cortex X1 will deliver a 30% higher peak performance than the Cortex-A77 while the new Cortex-A78 CPU provides a 20% sustained performance improvement overĀ Cortex-A77 CPU.
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