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MediaTek’s Dimensity 9300 SoC with TSMC’s N4P will be go head-on against Snapdragon 8 Gen 3

Nivedita Bangari by Nivedita Bangari
May 17, 2023
in News, Technology
0

According to a report from Digital Chat Station, MediaTek’s highly anticipated flagship processor is rumored to be named the Dimensity 9300. This advanced chipset will be manufactured using TSMC’s N4P process and is expected to be the result of a collaboration between Vivo and MediaTek. If the rumors hold true, the Dimensity 9300 might make its debut on the upcoming Vivo X100 smartphone.

The N4P process utilized in the Dimensity 9300 brings significant performance improvements compared to its predecessor, the 5nm technology (N5). These enhancements include an impressive 11% increase in performance over N5, a 6% improvement over N4, a remarkable 22% boost in power efficiency, and a 6% increase in transistor density. These advancements position the Dimensity 9300 as a formidable contender in the competitive mobile system-on-a-chip (SoC) market.

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In terms of architecture, the Dimensity 9300 adopts an ultra-large core + big core + small core layout.

Industry insiders speculate that the ultra-large core might be the Cortex X4, the big core could be the Cortex A715, and the small core may correspond to the A515. This intelligent design enables efficient and optimized processing for various workloads, promising users a seamless and exceptional experience.

Dimensity 9300
credit: gizmochina

Another advantage of the N4P process is its ability to facilitate easy migration for products based on the 5nm platform. This translates to reduced research and development costs for customers and enables faster and more energy-efficient updates for devices utilizing the 5nm platform.

The Dimensity 9300 is anticipated to make its official debut in the latter half of 2023. It will likely go head-to-head with Qualcomm’s Snapdragon 8 Gen 3, which is also slated for release during the same period.

The competition between MediaTek and Qualcomm is expected to drive further advancements in the mobile device market. With both chips offering significant performance improvements and optimizations, consumers can eagerly anticipate more powerful and efficient devices in the near future. The stage is set for an exciting showdown between these industry giants, and users stand to benefit from the remarkable progress in mobile SoC technology.

Also Read:

  • Indian Wearable device market sees 80.9% YoY increase in shipment during Q123
  • AMD Radeon RX 7600 and NVIDIA GeForce RTX 4060 Ti 8GB Cards to launch simultaneously

Source

Tags: Dimensity 9300MediaTekQualcommSnapdragon 8 Gen 3TSMC
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