While Qualcomm is already being slain by MediaTek both in terms of performance & efficiency as well as in sales worldwide. Now, to make things even worse for Qualcomm, at the start of this month it announced the new Dimensity 8000 series 5G SoCs for premium mid-range smartphones and benchmarks show they are on par with Qualcomm flagship Snapdragon 8 Gen 1.
Yes, this TSMC’s 5nm based Dimensity 8100 is posing serious scores which can make Qualcomm tensed. The upcoming Realme GT Neo 3 has been spotted using this chip and it has posted a score of 969 points in Geekbench 5’s single-core test and 3923 points in multi-core.
These scores do not blow away the Snapdragon 8 Gen 1 entirely but are better than the Snapdragon 888 in multi-core, however, the Diversity 8100 result is just a leak which is of one benchmark of a single smartphone. So, we cannot draw any conclusion about its performance as of now, though it’s a bit weak in single-core against Qualcomm.
What’s more impressive about the Mediatek Dimensity 8100 is that it draws far less power when compared to the Snapdragon 888 and almost 40% less power than a Snapdragon 8 Gen 1. So, even if with that efficiency the Dimensity 8100 could reach Qualcomm’s new-age flagship-level performance despite being cost-effective then it’s a game-changing SoC by MediaTek undoubtedly.
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