AMD’s EPYC 7003-Series (Milan) processor which targets the data centers is the prime example of AMD’s expertise in the data center segment. But reports indicate that AMD is planning a complete overhaul for Milan that features 3D die stacking.
According to sources, the rumor in the market is that AMD will implement its chip stacking tech with Milan-X. However, Milan-X will retain the Zen 3 CPU cores and will probably max out at 64 cores, similar to the vanilla Milan chips. AMD plans to offer more bandwidth by offering X3D and stacking memory dies.
For now, the rumors don’t specify what kind of memory AMD will stack on Milan-X. However, we do know that AMD will tap its new 3D V-Cache technology. Using this technique, which AMD demoed earlier this year, enables stacking an additional SRAM onto the chip to boost L3 capacity.
However, we do have some lead in this case as the hardware detective momomo_us has uncovered the specifications for Milan-X. The OPNs (Ordering Part Numbers) can be found in AMD’s Product Master document, and according to the information offered, AMD’s Milan-X will launch under the EPYC 7073-series branding, which makes sense since Milan debuted under the 7003-series moniker.
The flagship will reportedly be the EPYC 7773X will most probably be the counterpart for the existing EPYC 7763. The EPYC 7573X, 7473X, and 7373X are probably equivalent to the EPYC 7543, 7443, and 7343, respectively. According to reports, Milan-X and Milan both share the same core configurations however, the clock speeds, remain a mystery.
As to whether this upcoming EPYC Milan’s will stand tall against Intel’s Sapphire Rapids remains to be seen. For more information stay tuned.
